Long-term franchised partnerships with premium manufacturers covering smart sensor ICs, MEMS pressure and acoustic sensing, MLCC, power and wireless charging, circuit protection and precision connectors.
One of the few domestic companies with full-stack sensor R&D capability; a national high-tech enterprise and Beijing 'Specialized & Sophisticated' enterprise. Products include an ultra-low-power PPG AFE (10 µA including LED current), a medical-grade ECG front end (112 dB SNR, 2–12 lead cascade), a fully integrated digital force-sensing chip for electronic skin and robotic touch, plus photoacoustic CO₂ sensors, palladium-alloy hydrogen sensors, particulate matter and human-presence sensing.
Zhejiang Xinna Material Science and Technology Co., Ltd., founded in 1994, is the industry-finance integration platform for the Hengdian Group's new-materials business and a national high-tech enterprise, mainly engaged in silica and electronic ceramics. Its MLCC Division was established in 2021 and has introduced advanced production equipment and instruments from Japan and Taiwan, building a leading full-process MLCC line in China: a 3,000 m² workshop with 12,000 m² of floor space, including a 4,000 m² Class-1000 cleanroom (measuring Class 500 in practice), two tape casters, four printers, eight stackers, three termination machines and ten taping machines, plus 150 professional test instruments. Products are manufactured to IEC 60384-21/22 and GB/T 21041/21042 in a plant certified to IATF16949, ISO9001, ISO14001 and ISO45001.
Founded by a team with German technical background, focused on MEMS sensing. Its capacitive barometers reach ±0.5 Pa resolution (about ±5 cm), ±6 Pa relative accuracy and below 0.5 Pa/K drift, with power as low as 3 µA @ 1 Hz and no re-calibration after SMT. Cumulative shipments exceed 50 million units, complemented by digital and analog MEMS microphones.
A national high-tech enterprise and Nanjing 'unicorn incubatee', member of the WPC wireless charging alliance. Portfolio covers 2–15 W Qi-compatible wireless charging Tx/Rx ICs, 2–4 cell Li-ion charger ICs, 50–70 A high-voltage DCDC µModules and high-reliability silicon capacitors, already designed into supply chains of major brands such as OPPO, Xiaomi, Motorola, Edifier, Panasonic, Lenovo and Philips.
Founded in 2001 as a national high-tech enterprise with 800+ employees, offering in-house tooling, stamping, injection molding, plating and fully automatic assembly. Monthly capacity reaches 2.6 billion stamped parts and 100 million assembled units. Certified to ISO9001, ISO14001, SONY GP and QC080000, serving world-class customers such as Samsung, Sony, Foxconn, Quanta, Compal and Huaqin (Huawei ODM).
A professional precision connector manufacturer covering the full 0.5–2.5 mm pitch range: FPC connectors (ZIF / Non-ZIF, flip / slide / drawer, SMT / DIP), locking wafer wire-to-board connectors, 3.5 mm high-voltage headers, shielded or copper-laminated FFC ribbons and JJS-series custom harnesses. Gold or tin plating, operating from -40 °C to 105 °C.
高特微电子
ESD / TVS protection津日
MEMS microphones / sensors华景
MEMS microphones裕芯
Charge management ICs矽诺微
Audio amplifier ICs芯存
Memory / SD cards翊腾
ZIF / FPC connectors电连技术
RF & precision connectors亚奇
High-precision board-to-board connectors意丰
Type-C / precision connectors增嘉
Connectors和盛鑫
2.0 / 2.5 pitch connectors博众
Battery holders / contacts华科鸿溟
Discrete semiconductors高松
Electronic componentsAll key brands listed hold franchise authorization certificates issued by the manufacturers, with fully traceable sourcing. Scanned copies can be provided for verification before cooperation.
The 'more brands' list includes franchised, channel-supplied and long-term cooperating brands. Please confirm the exact authorization type with our sales team.
